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At Data Center World 2026, LG Electronics showcased its latest suite of integrated thermal management and power solutions designed specifically for the high-density requirements of AI data centers. The highlight of the exhibition was LG’s Direct-to-Chip (DTC) liquid cooling system, featuring a non-tapered fin structure for enhanced heat dissipation and a massive 1.4MW Coolant Distribution Unit (CDU). This system is engineered to stabilize high-performance computing (HPC) environments while maximizing energy efficiency through advanced sensor-driven inverter pumps.

Beyond liquid cooling, LG expanded its portfolio into Immersion Cooling through strategic partnerships with GRC and SK Enmove, offering specialized tanks and dielectric fluids for direct hardware submersion. To orchestrate these complex systems, LG introduced the Data Center Cooling Management (DCCM) software, which provides 3D visualization, predictive maintenance, and real-time workload-based control. By bridging the gap between chip-level cooling and facility-wide infrastructure, LG is positioning itself as a total solution provider for the next generation of digital infrastructure.