China’s CXMT to Power Xiaomi 18 Fold with Next-Gen LPDDR6 DRAM Chips
China’s ChangXin Memory Technologies (CXMT) is set to supply its latest LPDDR6 DRAM chips for Xiaomi's upcoming foldable smartphone, the Xiaomi 18 Fold. The move highlights the rapid progress of China's semiconductor sector in narrowing the technological divide with global memory chip giants.
CXMT announced the commencement of mass production for the LPDDR6 chips, which Xiaomi will integrate into its flagship foldable device slated for launch this September.
The LPDDR6 represents CXMT's most advanced mobile dynamic random-access memory technology to date, arriving less than a year after the company kicked off mass production of its LPDDR5 chips. Xiaomi plans to pair the memory with an upgraded iteration of its in-house Xring O3 processor, fabricated on a 3-nanometer process node and engineered with native LPDDR6 support.
Ramping Up Competition and Financial Growth
As China's foremost memory chipmaker, CXMT is accelerating the development and fabrication of advanced memory architectures to close the competitive gap with industry leaders Samsung Electronics and SK Hynix.
In its inaugural earnings disclosure following its public listing, CXMT reported a swing to profitability during the first half of the year, powered by an 874% year-on-year surge in revenue to 150.3 billion yuan ($22.36 billion).
CXMT has also begun shipping LPDDR6 samples to prospective clients for deployment across smartphones, mobile devices, enterprise servers, and smart automotive systems.
These technological milestones unfold amid rising legal tensions between the Chinese chipmaker and Washington, following a lawsuit filed by CXMT against the US Department of Defense challenging its designation on a blacklist of entities alleged to assist the Chinese military.
Keywords: CXMT, Xiaomi 18 Fold, LPDDR6 DRAM, Semiconductors, Memory Chips, 3nm Processor, Samsung Electronics, SK Hynix, Chinese Tech.